At Embedded World 2024, DFI, the world’s leading brand in embedded motherboards and industrial computers, unveiled its groundbreaking EV Charger application, responding to the surge in electric vehicle (EV) usage and the corresponding need for an extensive EV charging...
Innodisk is demonstrating its latest embedded and AI solutions tailored for smart manufacturing at Embedded World 2024 in Nuremberg, Germany. With a primary focus on enhancing productivity, efficiency, and safety in industrial environments, Innodisk’s showcase this...
DFI has announced the launch of its latest innovation, the DFI QCS051 Industrial Motherboard, at Embedded World. Crafted to address the intricate needs of modern industrial automation, the QCS051 integrates the Qualcomm® QCS6490 processor, offering versatility for...
The manufacturing of micro medical devices, with their increasingly complex geometries and tiny dimensions, presents unique challenges to manufacturers. When the final product is only millimetres wide, the internal minuscule scale of the components involved must be...
MVTec Software is strengthening its activities in Taiwan and establishing its own subsidiary in Hsinchu, southwest of Taipei. The new...
Ceva has launched Ceva-Waves™ Links™, a new family of multi-protocol wireless platform IPs to accelerate enhanced connectivity in MCUs and...
Automated optical inspection (AOI) of wafer-based solar cells requires a combination of 2D and 3D imaging to detect imperfections in...
The markets are changing, and thus so are the requirements of the process manufacturing industry. Whether it is fluctuating demand, more...
A variety of networking opportunities will be available for attendees to network and connect with robotics industry professionals. Learn...
DFI announces the launch of its innovative product lineup featuring Windows on Arm (WoA) at Embedded World 2024. DFI NXP products deliver...
The latest DC power supplies from Rohde & Schwarz for every-day manual use in the laboratory as well as for automated applications...
Teledyne FLIR IIS announces SightBase® – an advanced Software-as-a-Service (SaaS) platform that accelerates the design-in cycles for...
Emerson will present the future of automation through its Floor to Cloud™ approach and innovative automation solutions at Hannover Messe...
Specim announces the enhanced SisuROCK, a state-of-the-art spectral imaging instrument designed for rapid and accurate core logging in the...
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