Emerson: Global technology, software and engineering leader Emerson will exhibit its Floor to CloudTM packaging solutions at PACK EXPO Las...
Results for "amd"
Emerson to showcase Floor to CloudTMpackaging solutions at PACK EXPO 2023 (Booth SL-6107)
Emerson: Global technology, software and engineering leader Emerson will exhibit its Floor to CloudTM packaging solutions at PACK EXPO Las...
Mikrotron Cameras Selected for Adaptive Optics Upgrade at Inouye Solar Telescope
The Daniel K. Inouye Solar Telescope is a scientific facility for studies of the Sun on the Hawaiian island of Maui. The National Solar...
Teledyne e2v Unveils 8K Image Sensor for Logistics
Teledyne e2v’s new 8K image sensor delivers wide FOV for high-throughput logistics vision systems. Teledyne e2v announces Snappy Wide, a...
AAEON: Live Demos at Embedded World China
Experience AAEON’s innovations, applications, and demonstrations in Shanghai. AAEON will be attending Embedded World in Shanghai, China...
Nvidia Market Cap Exceeds $1 Trillion, IDTechEx Reports
While the current AI boom is only just getting started, an early winner is Nvidia, who – on Tuesday, May 30th – saw the company’s market...
DFI Launches Smart Transportation Solutions at Computex
DFI launches new smart transportation solutions focusing on AI edge computing, information security, and the development of sustainable...
DFI to Showcase Solutions at Embedded World
DFI will present their latest embedded products and AIoT solutions at Embedded World, focusing on edge AI opportunities. DFI (2397), the...
IDTechEx Research Automotive Semiconductors
IDTechEx research has found out that semiconductors for automated driving will grow at a 10-Year CAGR of 29%. IDTechEx’s new “Automotive...
Surplex: Machinery auction following tool manufacturer’s closure
Until 24/01/23, over 100 machines and accessories from a Hungarian tool manufacturer will be available for auction on Surplex.com....