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VISION 2018. What’s happening?

  • By Jason Stockwell

A look at what’s happening and who’s exhibiting at this year’s top machine vision event.


International Vision Night 2018 VISION 2018 traditionally kicks off with the EMVA International Vision Night.

The 12th International Vision Night 2018 takes place on 05 November in the restaurant “Plenum” situated in the heart of Stuttgart and integrated in the state parliament building; the same location this EMVA networking event was also held two years ago. Even at night the venue with its glass walls provides a magnificent view on the Stuttgart castle with its gardens, the opera and the city lake.

As the perfect attunement to the eagerly anticipated biannual show days, the International Vision Night on the evening prior to the VISION 2018 opening offers the perfect mixture of networking and celebrating in a relaxed atmosphere. Since usually the international machine vision scene has already arrived in Stuttgart, this evening offers the perfect opportunity to meet and talk to business partners, colleagues and friends.


Key Exhibitors

Allied Vision

Focus on new camera for Embedded Vision

With the slogan “Rethink Embedded Vision”, Allied Vision will be welcoming visitors to the world’s leading machine vision trade fair at the Stuttgart Exhibition Center with a clear focus on embedded vision. The new Alvium Camera Series which will be presented to the VISION audience for the first time, will be the highlight of the booth. With extensive functions for image correction and optimization, a large selection of current sensors, intelligent energy management, and cost-optimized design, the new camera series combines the advantages of classic machine vision cameras with the advantages of embedded sensor modules. It opens up new ways for users to switch from PC-based image processing applications to embedded systems.

From the presentation of the various camera models, the selection of compatible embedded boards and available interfaces to the optimal software connection, visitors will receive comprehensive information about the versatile possibilities of the new embedded camera module. Several live demonstrations running on different embedded boards show cameras of the Alvium Series in action.

Camera solutions from high-speed to infrared

However, the presentation of new products is not limited to the field of embedded vision. Allied Vision’s new high-speed camera family Bonito PRO, which has a CoaXPress interface and was specially designed for applications with high bandwidth requirements, can also be experienced at VISION 2018 for the first time. Equipped with four DIN 1.0/2.3 connectors, the cameras can transmit 25 Gigabits per second via the CXP-6 high-speed connections. The new camera will be on display at the booth as part of a PCB inspection application.

Allied Vision will also be previewing the new 50 Megapixel camera Prosilica GT10000 with the KAI-50140 large-format CCD sensor from ON Semiconductor. The sensor is characterized above all by its very high resolution of 10,440 × 4,800 pixels. The 2:1 aspect ratio makes the camera particularly suitable for display inspection, aerial photography, and optical metrology.

With the new Mako G-508 POL, which is equipped with an 5.0 Megapixel IMX250MZR/MYR CMOS polarization sensor with the latest polarization filter technology from Sony, Allied Vision presents another product innovation. The new filter technology can reduce reflections which, for example, hinder the inspection of surfaces.

At the Allied Vision booth, almost all current Machine Vision camera families from the extensive Allied Vision portfolio will also be presented: from the ultra-compact Mako camera to the versatile Manta to the Goldeye for infrared applications. Numerous inspection applications show the cameras live in action. The interaction with the most common image processing libraries will also be presented.


World First: Smart Infrared Cameras for Industry 4.0

Will present its globally unique new smart infrared cameras of the IRSX.

With these cameras, intelligent, self-contained thermal imaging systems that are consistently designed for industrial use are available for the first time. The web-based configuration interface and result display make the setup for thermal monitoring tasks child’s play. After installation, the IRSX cameras communicate directly with the process ontrol and provide an outstanding functionality for the practical implementation of Industry 4.0.

Designed as an all-in-one solution, the IRSX cameras combine a calibrated thermal imaging sensor with a powerful data processing unit and a variety of industrial interfaces in a small, rugged IP67 housing. A computer, special thermal imaging software or external interfaces are no longer required.

This considerably reduces the system complexity, the installation effort and the costs while significantly improving the system stability. For the communication with external automation and control equipment, the cameras feature a multitude of protocols, including GigE Vision, Modbus TCP, HTTPS and FTP.

A comprehensive range of software tools supports the integration and use of the cameras. In addition to standard APIs such as REST, GigE Vision, MQTT and OPC-UA, this also includes a constantly growing number of application-specific apps.

The IRSX series comprises a variety of models with different fields of view, frame rates and resolutions and covers a broad spectrum of applications in all areas of industrial process automation. Wherever temperature has a decisive influence in the manufacture and processing of products, the IRSX cameras provide a highly flexible solution for autonomous thermal monitoring. A further application focus is the preventive early fire detection and plant condition monitoring. Once set up, the intelligent cameras automatically detect temperature anomalies and trigger an alarm long before a fire breaks out or a system fails.


Innovative products and solutions, under the banner of Vision That Works

It will present innovative new products and further developments of its portfolio for a broad range of applications.

In the performance segment, Basler shows an approach that addresses the availability of new interfaces and new sensor generations while meeting the market demand for higher resolution and higher frame rates. The combination of Basler cameras and compatible frame grabbers is a decisive benefit for the customer.

Visitors to the exhibition can also look forward to new models from the successful ace series. The manufacturer shows its ace model, which was developed as a 1: 1 replacement for Sony’s discontinued CCD sensor ICX618. In the higher-resolution segment, Basler will introduce four 20 MP ace U models based on the Sony Pregius IMX183.

Another highlight is the new Embedded Vision Development Kit consisting of Qualcomm’s ARM-based SoC with integrated ISP (Image Signal Processor), the Snapdragon 820, the Basler dart 5 megapixel camera module with BCON for MIPI interface and the pylon Camera Software Suite for Linux operating system. A sophisticated live presentation, implemented with Basler’s Time-of-Flight camera, demonstrates a large and cost-optimized system integration with embedded vision.

In addition, visitors to the show can look forward to new accessories and a unique concept in the field of lighting, centered on maximizing customer value. Customers benefit from easy integration and optimized total system costs.

Basler’s presence at the VISION 2018 will be rounded off by presentations at the exhibitor forum.


New GigE cameras with integrated JPEG image compression save bandwidth, CPU load and storage space

Baumer is enhancing the LX series with 2, 4 and 25 megapixel cameras with integrated JPEG image compression and frame rates of up to 140 fps. With the GigE cameras, you can save all down the line: from bandwidth through CPU load to storage space – this simplifies the system design and reduces integration costs. Serial production will start in Q4/2018.

These new models are particularly well suited for applications that require long image sequences, but do not have to transfer and save the complete original images, for example in process monitoring or motion analysis in sports.

The JPEG compression rate is configurable so that the image quality can be adapted to meet the needs of the individual application. Data reduction in the range of 1:10 to 1:20 can be achieved.

The JPEG image compression takes place directly in the FPGA of the camera, which offers many advantages. A reduced bandwidth like that of Gigabit Ethernet is sufficient for the highspeed transmission of high-resolution images. This allows a cost-effective and flexible system design. At the same time, the PC-based image processing system is relieved of CPU-intensive algorithms for image compression, so that a PC is sufficient even for operation with multiple JPEG cameras. To bridge longer distances, it is also easily possible to use a GigE switch. Compared to the transmission of full frames, applications also benefit from reduced storage space requirements, which cuts costs for hardware as well.


Entner Electronics

Will feature its new UC-310 camera for embedded vision systems.

The UC-310 is a compact software programmable camera with proprietary electronics and a high quality zoom lens for unprecedented image quality.

The new camera uses a rolling shutter STARVIS sensor to offer a high sensitivity and dynamic range in visible light conditions.

The read-out electronics are optimised to reduce the rolling shutter artefacts by a factor of two compared to current industry standard cameras. This allows integrators to benefit from the advantages of rolling-shutter sensors such as the use of compact, weight reducing optics


Evt Eye Vision

On display will be the company’s range of products, including EyeCheck (smart cameras with integrated image processing software) and EyeVision Thermo, which supports thermal imaging cameras by Optris, Automation Technology, Flir and Dalsa.


Euresys / Sensor To Image

Highlights at Euresys’ booth will include demonstrations of the latest CoaXPress frame grabbers, the Coaxlink Quad CXP-12, a new four-connection 12-Gbps CoaXPress 2.0 frame grabber. CXP-12 is the top speed of the latest version of CoaXPress 2.0. It operates at exactly 12.5 Gbps! So it is twice the existing speed of the CXP Standard. We also demonstrate the Coaxlink Octo, a 8-connection CXP-6 frame grabber. Both support CustomLogic: custom on-board FPGA processing for Coaxlink.

The latest two libraries of Open eVision will also be demonstrated: EasyDeepLearning, a Convolutional Neural Network-based image classification library. EasyDeepLearning has been tailored, parametrized and optimized for analyzing images, particularly for machine vision applications. EasyDeepLearning has a simple API and the user can benefit from the power of deep learning with only a few lines of code. Easy3D is a set of software tools to build 3D inspection applications. Easy3D is able to generate a depth map from a series of images that contain a laser line projected on the inspected object and computes a calibration model applied to depth maps to transform them into calibrated 3D point clouds. It provides functions to generate such ZMaps.

Also on display the new Camport video converters. This new generation of video converters makes it possible to update a wide range of existing cameras and other image sources to support the latest vision interface standards. So they can improve performance and range of a camera that perfectly fits the application’s requirements.

And finally, we’ll include the Picolo.net HD1 H.265 video server. It stream video from one Full HD (1080p60 or 1080i60) source over an IP network.

Sensor to Image will be present at Euresys’ booth and will feature its new products. As specialist for GenICam compliant machine vision interfaces, we will demonstrate the latest versions of the GigE Vision 2.1 , USB3 Vision and CoaXPress 2.0/CXP-12 IP cores. On the frontend side, we will demonstrate solutions to interface sensors with output according to the MIPI CSI protocol and Sony IMX Pregius imagers.

Please do not hesitate to contact your Euresys Sales Manager for further information.


Frankfurt Laser: new high power line laser modules

The ML2040-Series, from the Frankfurt Laser Company, deliver high output power of up to 2W and are ideal for the use in industrial applications with harsh environmental conditions. The offered wavelengths range from 450nm to 1060nm.

Apart from round and line beam, other beam shapes like grids, circles or line and dot arrays are available. The line beam has a sharp rectangular shape with homogenous power distribution along the line. The housing is electrically isolated and keeps the protection class IP65 (IP67 optional) conditions. TTL and analogue modulation are optionally available. The power stability is <1% over 24 hours.


Fujinon anti shock and vibration technology

Industrial imaging systems are frequently subject to strong accelerations, shocks, and vibrations. This is especially true for mobile systems, like robot-guided 3D scanners, but also for fixed installations. Such mechanical stress often causes a significant reduction of the resolution and a shift of the optical axis – severe problems for machine vision, optical metrology applications and optically calibrated systems.

Fujifilm has investigated the impact of shocks and vibrations on industrial fixed focal lenses via a dedicated test procedure. Depending on focal length and model the optical axis is shifted up to 26 μm, which corresponds to approx. 7 pixels with 2nd generation Sony Pregius sensors. Such kind of specification is not presented in most datasheets, but crucial in the selection process of lenses for optical metrology.

Further investigations led to the development of the Fujinon Anti-Shock & Vibration technology. The new lens design is based on an elastic and patent pending fixation of the internal lens arrangement. With this new technology incorporated into several Fujinon Machine Vision lenses the shift of the optical axis can be reduced down to just 4 μm and the resolution degradation is minimized. The new mechanical design makes lenses maintain their high optical performance despite the shocks and vibrations that unavoidably occur in industrial imaging systems.

The following lenses are already equipped with the FUJINON Anti-Shock & Vibration design:

  • All lenses of the HF-12M series for pixel sizes from 2.1 μm and sensors up to 1”
  • HF-5M series for pixel sizes from 3.45 μm and sensors up to 1.1”:
  • 6mm and 50mm focal length

Gardasoft Vision Ltd

In addition to the announcement of a new lighting controller, Gardasoft will be presenting a number of new demonstrations to illustrate the power of machine vision sequencing and control technologies. These will cover computational imaging, ultrafast focusing, OEM controllers and multi-light line scan stations. The new lighting controller will open up new illumination possibilities that will further contribute towards novel machine vision solutions. VISION provides the first chance to see the application of Gardasoft’s RTCC series of lighting controllers for high-speed computational imaging.

The controller will be used to drive a segmented dome light to allow a rapid sequence of images with different illumination angles to be acquired by a smart camera. The camera will use computational imaging software to extract surface detail that cannot be seen using conventional imaging methods.

Three controllers will be in action to demonstrate high-speed focusing on objects of different heights using a liquid lens from Optotune AG. A CC320 timing controller, positional encoder from a moving platform, camera and RC120 lighting controller will be linked together to give the required camera exposure and illumination needed for imaging. A TR-CL-180 liquid lens controller will be used for high speed adjustment of the lens for focusing. In addition there will be the chance to explore control options for OEMs through the board level TR-100 and TRCL- 190 lighting and liquid lens controllers.

VISION will also provide the opportunity to see how multiple lights can be used with line scan cameras for the capture of image sequences under different lighting conditions. Information from different LED sources is captured on sequential lines and individual images for each source extracted using software.

IDS Imaging Development

IDS will not only present new models of the vision app-based platform IDS NXT but also pioneering solutions for 3D image processing. The new Ensenso XR series with integrated data processing will be shown for the first time. Novel focusable USB 3.1 Gen 1 board level industrial cameras with liquid lens control will be on show at exhibition stand in hall 1, 1F72, together with additional product innovations and numerous live demonstrations for visitors.

IDS is very familiar with the role as a pioneer: the company was among the first to use USB as an interface for digital industrial cameras. At VISION it will introduce new models, functions and applications which demonstrate that the IDS NXT platform of vision app-based industrial cameras can change the image processing industry in a similar way. For example, the app-based approach allows recurring vision tasks to be set up and changed easily and in a very short time. With the ability to create any vision-based app, IDS NXT can be used in numerous applications and industries.

For higher flexibility regarding 3D vision applications, the camera specialist will also present a prototype of the new Ensenso XR series with on-board processing: In contrast to the cameras of the N and X series, which use computers to calculate the 3D point clouds, this model can calculate them itself. Moreover, the 3D data can also be transferred directly to a control unit via GenICam in the future. Ensenso XR hence enables new scopes for application design, accurate acquisition of details and significant acceleration of data processing.

Various demonstrations will emphasize what the different products in the camera manufacturer’s portfolio are capable of. For example, IDS will show the new USB 3.1 Gen 1 board level cameras with liquid lens control. They facilitate image acquisition at variable object distances as their focus can be readjusted quickly and comfortably via user interface or API. The cameras are available with a 6.4 MP rolling shutter sensor from Sony or the highly photosensitive 18.1 MP rolling shutter sensor from ON Semiconductor, and are equipped with S-Mount or CS-/C-Mount, twist-proof USB Type-C connection and practical USB power delivery.


JAI

JAI will be presenting a range of new industrial area scan and line scan cameras.
New 3-sensor line scan camera with 10 GigE interface (Sweep+ Series):
JAI will demonstrate the world’s first prism-based RGB color line scan camera (Sweep+ SW-4000T- 10GE) based on a backwards compatible 10GBASE-T GigE Vision interface delivering 10 Gbps output. The camera is backwards compatible to NBASE-T (5 Gbps and 2.5 Gbps) and 1000BASE-T (1 Gbps). With a resolution of 4096 pixels per channel and a maximum speed over 100 kHz (100,000 lines/second) this camera is designed to cover a wide range of industrial line scan imaging applications – from the lowest to the fastest speeds.

New trilinear color line scan camera in the Sweep Series:
JAI has added a new high-speed trilinear CMOS color line scan camera (SW-4000TL-PMCL) to its Sweep Series camera family. It features 4K (4096 pixels) resolution and a maximum full line rate of 66 kHz for 24-bit non-interpolated RGB output. Features include horizontal and vertical binning, built-in color space conversion functions as well as direct encoder connection and auto-detection of scan direction.

New polarization camera in the Go Series:
JAI will also launch a new polarization area scan camera in the Go Series. The new model (GO-5100MP-USB) is built around Sony’s IMX250MZR CMOS image sensor. With 5.1-megapixel resolution and an innovative 4-way polarized filter design it is ideal for inspecting plastics, glass, and other shiny materials in industrial vision applications.

Expanded Spark Series of high performance area scan cameras:
Among the new cameras also on display are new 12.4-megapixel low noise/high performance industrial area scan cameras belonging to the Spark Series. These cameras utilize the Sony Pregius IMX304 CMOS image sensor and include both color and monochrome models. The model SP-12401- PGE provides 9.3 fps over a GigE Vision interface whereas the SP-12401-USB, with a USB3 Vision interface, delivers 23 fps. The 12-megapixel model with Camera Link interface (SP-12400-PMCL) is designed with Pregius IMX253 and runs with 64 fps. Color models feature several advanced color imaging features including multiple color space conversions, built-in 5×5 de-Bayering capability, and a 6-way color enhancement function.

Microscopy solution with the new Apex Series 3-CMOS cameras:
On the booth, visitors can also see a demonstration of a range of new 3-CMOS prism based color RGB area scan cameras in the Apex Series (AP-3200T and AP-1600T) with 3.2-megapixel and 1.6-megapixel resolution respectively. These cameras are developed to meet the most demanding color vision applications in machine vision and medical imaging. Special Apex models are dedicated microscopy applications in life science and industry and compatible with ImagePro from MediaCybernetics and open source μManager image analysis software


LMI to unveil three new FactorySmart 3D Inspection products

LMI will unveil three new 3D inspection products, including live product demos.

Gocator 2500 Series Smart 3D Laser Line Profilers

Gocator 2510 and 2520 are the most advanced Gocator line profilers to date. Designed for high performance small parts inspection, these high-speed sensors generate precision 3D scans down to 8 μm X resolution.

With a custom high-speed imager, advanced optical design, dedicated FPGA processing, and built-in measurement tools for 3D alignment, part segmentation, and 3D feature extraction, Gocator 2500 sensors handle the complete processing pipeline–from raw image data to 3D result–in an all-in-one device that operates at inspection rates up to 10kHz.

Gocator 3504 Smart 3D Snapshot Sensor

At 6 μm the Gocator 3504 is the highest XY resolution 3D snapshot sensor on the market today. Combine that with +/-0.5 μm measurement repeatability, and this groundbreaking sensor provides robust inline factory automation for sub-micron level inspection.

The 3504 has an industrial stereo camera design and point-and-shoot technology inside a ruggedized industrial package that allows for highly accurate inspection without a motion stage. The sensor is pre-calibrated and ready to measure out-of-the-box using just a web browser.

The Gocator 3504 sensor can be used in a wide range of electronics and medical applications such as connector and pin coplanarity, wire detection, surface flatness and stent inspection.

GoMax Smart Vision Accelerator

GoMax is a cost-effective hardware solution that allows users to accelerate any Gocator® 3D smart sensor in order to meet inline production speed, without the need for an industrial PC.

This plug-and-play approach connects directly to any Gocator® model and speeds up the sensor by taking over a portion of the data processing (including point cloud generation, 3D measurement, and PLC/robot communication).

“The launch of these products continues to advance our FactorySmart approach to automated inline quality control, automation, and optimization. By offering new benchmark products in three key technology areas, LMI is serving the full spectrum of machine vision customers and working to continually meet their specific application demands,” said Terry Arden, CEO.

Q&A with Terry Arden, CEO, LMI Technologies

1. Thoughts on how the vision sector is going to develop?
I anticipate ongoing consolidation among vision suppliers–including optics, lighting, cameras and software. At the same time, machine/deep learning is giving new life to many complicated 2D problems. 3D will continue to challenge 2D applications because of its ability to see shape, and the fact that it is invariant to color or position, immune to ambient light, and pre-calibrated to measure out-of-the-box.

2. By the next vision show (2020) what will the vision industry look like?
Every year we see new technologies grab our attention, only to fade into the background as the next innovative solution emerges in a constant wave of change. This is true of cobots, IIoT, Industry 4.0, embedded vision, MIPI, deep learning, hyperspectral imaging, polarization, NBaseT, and so on. So you can be sure that by 2020 we will face a new vocabulary of technology concepts fighting for our attention, each one subtly extending machine vision capabilities and reaching into new market opportunities.

Manufacturers are constantly looking to drive costs down through innovation and increased performance. And from time to time, within that framework, truly revolutionary steps are made. All of this is driven by the tremendous opportunity to automate, inspect, optimize, and generally make factory processes smarter.

In 2020, the camera companies will be fewer and larger, with perhaps a much greater Chinese presence. There will also be an explosion of AI that uses deep learning to do just about anything and everything, from opening up possibilities in retail and consumer driven markets to changing the way we think about performing traditional 2D inspection.

By that time, NBaseT will finally have stepped up to boost the aging GigE bandwidth from 1 to 5 GB/sec. And any embedded device supporting the smart factory will have full support for most robots, further powering the robot vision global megatrend.

3. What excites you about the future of the machine vision industry?
Traditional approaches to applying 2D vision for inspection are painful. To this day it remains the unenviable task of the system integrator to combine cameras, lenses, lighting, calibration and software in order to deliver a robust solution. Even when a 2D solution is deployed, constant monitoring is required to ensure the effects of ambient or factory lighting, temperature drift, vibration, and build up of dust or moisture don’t degrade performance.

This is where I see 3D solutions making a major impact. 3D adds the dimension of shape, not just contrast (you get both!) and is unaffected by ambient light, object color, or object movement. 3D sensors are fully calibrated and ready to measure–which avoids imprecise calibration in the field. They are IP67 and ready for harsh factory conditions, and can compensate for temperature drift in order to maintain micron tolerances.

And the list goes on.

When a 3D sensor is made smart with onboard processing (to reduce raw data to pass/fail decisions), and can communicate results to PLCs or robots over a factory network, then you have created the right conditions to effectively replace 2D solutions with 3D smart sensors.

In general I think the future will see 3D advance in speed (10-50 kHz profile rates), resolution (down to 2-3 μm), package size (super small IP67 to fit just about anywhere), and easy measurement tools that are closely aligned to quality processes (GD&T and GRR). The integrator will begin to smile again with the discovery of how easy 3D is over 2D…. 🙂


LUCID to Introduce the Triton and Atlas GigE Vision Cameras

Showcasing the IP67 Triton industrial camera packed into a 29 x 29 mm size, and the 5GBASE-T Atlas featuring the new 31 Megapixel Sony Pregius global shutter sensor.

Will introduce two new GigE Vision camera lines and showcase innovative imaging technologies under the theme “Be Inspired.” Visitors to the LUCID booth will see live product demonstrations and draw inspiration from the latest camera technologies suited for their next machine vision application.

The Triton camera sets a new price performance standard in the industrial camera market. Active Sensor Alignment for superior optical performance, a lightweight, compact 29 x 29 mm size, and IP67 protection with a sealed lens tube make the Triton camera suitable for harsh industrial environments. The M12 Ethernet and M8 GPIO connectors provide a robust and sturdy connection resistant to shock and vibration.

The GigE Vision and GenICam compliant Triton camera ranges from 0.4 MP to 20 MP and will include the 5 MP Sony IMX250MZR/MYR polarized sensors, the 12.3 MP Sony IMX304 global shutter CMOS and the 20 MP Sony IMX183 rolling shutter CMOS sensors. The first Triton model will be released in Q3 2018 featuring the 5 MP Sony Pregius IMX264.

The Atlas is a 5GBASE-T PoE camera capable of 600 MB per second data transfer rates offering 5 times more bandwidth than GigE cameras. The large format Atlas camera allows for higher resolutions and higher frame rates over standard Ethernet cables up to 100 meters. Measuring only 55 x 55 mm, the Atlas is equipped with a M35 lens mount which can easily be adapted to F-mount.

Just like Triton, the Atlas also features Active Sensor Alignment for superior optical performance with large image sensors. The first model will feature the new 31 MP Sony Pregius IMX342 APS-C format global shutter CMOS, followed by the 19 MP IMX367 and the 16 MP IMX387 sensors.

At the Industrial Vision Days forum organized by VDMA Machine Vision, LUCID’s Product Manager Nina Chen will give a presentation titled “Going Polarized: Adding a New Perspective to Industrial Imaging” on November 8th at 2.30 pm.

Matrox Imaging at Vision

Stuttgart – Product Preview This year’s focus is on the newest version of Matrox Design Assistant flowchart-based software, including new tools for image classification using deep learning and image registration using photometric stereo. These tools will illustrate inspection and OCR of hard-to-see text.

Paired with this software will be a Matrox Iris GTR smart camera and a Matrox 4Sight GPm vision controller with a GigE Vision® camera, demonstrating the extent of platform flexibility. Matrox Rapixo CXP —a CoaXPress 2.0 frame grabber programmed using Matrox Imaging Library (MIL) software—will conduct high-speed video capture with a CXP area-scan camera. The newest vision controller, the Matrox 4Sight EV6, will likewise be on display.

Booth 1E17 will also feature demonstrations highlighting reading of PharmaBraille text, 3D profiling for tire tread inspection, and verifying ID marks using feature-based OCR. These demonstrations will highlight the depth of expertise found within the Matrox Imaging global network.

Featured products:
Matrox Design Assistant
An integrated development environment (IDE) for creating machine vision applications using a flowchart instead of traditional program code. Latest updates include new tools for image classification using deep learning, photometric stereo, dedicated shape finders, and native support for 3D sensors, amongst others.

Matrox Imaging Library (MIL)
A comprehensive software development kit (SDK) with tools for application feasibility to prototyping, development, and deployment. An interactive demo area will allow attendees to see the MIL CoPilot interactive environment for experimentation, prototyping, and code generation, as well as the latest advances in image classification using deep learning.

Matrox 4Sight EV6 – Coming soon!
A fanless industrial computer based on an Intel® 7th-generation Core™ processor and built for the factory floor. Multiple Gigabit Ethernet ports facilitate multi-camera inspections, while PoE support helps simplify cabling.

Matrox Rapixo CXP
A family of frame grabbers supporting the CoaXPress 2.0 digital interface standard. A separate FPGA development kit (FDK) enables development of custom FPGA configurations to offload and accelerate image-processing functions from the host system.

Matrox Iris GTR
A line of compact, capable smart cameras designed for tight spots and dirty industrial environments. Matrox Iris GTR offers software flexibility, pairing readily with the Matrox Design Assistant flowchart-based IDE or MIL SDK.

Matrox Vision Academy
A comprehensive library of on-demand instructional material on how to use and deploy MIL and Matrox Design Assistant vision software. Designed to deconstruct complex topics into micro-learning modules, Matrox Vision Academy facilitates self-directed, just-in-time learning.

Matrox Professional Services – Coming soon!
An offering of deeper technical assistance to help customers save valuable development time and deploy solutions more quickly. Services include personalized training, assessing project feasibility, application prototyping, troubleshooting, and debugging, and device interfacing.

About Matrox Imaging
Matrox Imaging is an established and trusted supplier to top OEMs and integrators involved in machine vision, image analysis, and medical imaging industries. The components consist of smart cameras, vision controllers, I/O cards, and frame grabbers, all designed to provide optimum price-performance within a common software environment. For more information, visit www.matrox.com/imaging.


MVTec Software

MVTec Software GmbH presents its entire range of cutting-edge technologies at VISION 2018, the leading international trade show for machine vision in Stuttgart, Germany.

From November 6 to 8, visitors of booth E72 in hall 1 will experience the latest HALCON 18.11 and MERLIC 4 software releases. MVTec will vividly showcase future-oriented topics such as deep learning, embedded vision, deflectometry, process integration, 3D vision, hyperspectral imaging, and more in fascinating live demonstrations and practical presentations by experts.

HALCON 18.11: Deep learning and embedded vision

HALCON 18.11 will win users over with numerous improvements and new functions, some of which are based on deep learning, an artificial intelligence methodology. In addition, the software, which will be released on November 30, offers expanded embedded vision capabilities. The release also provides helpful new functions for developers.

In an interesting live demo with an UR3e robot, MVTec will demonstrate an industrial application scenario with HALCON 18.11. The robot arm will reach into a collection of objects and reliably locate the position of the relevant object, thanks to HALCON’s modern matching technologies. The arm precisely removes this object from the crate, recognizes it by means of innovative deep learning functions, and sorts it.

Another demo offers proof of MVTec’s many years of in-depth embedded vision expertise. Furthermore, it shows MVTec HALCON’s complete compatibility with many important hardware standards: Three embedded boards and a smart camera are each set to a machine vision task. The corresponding cameras are aimed at an analysis object, which is moved horizontally at high speed. This illustrates how quickly and robustly the standard machine vision software works on a wide range of common embedded hardware components.

There will also be a demo of the ready-to-use HPeek system image for the Raspberry Pi. HPeek is MVTec’s license-free benchmarking demo program, which is available free of charge and can be used to evaluate HALCON’s performance on Arm®-based embedded platforms in real-life applications.

As one more highlight, the inspection of objects with reflective surfaces with the aid of deflectometry will be demonstrated.

In this method, reflections of known patterns on the particular object surface are evaluated to locate defects. Based on this principle, the demo automatically checks different defective objects in two inspection stations and unequivocally localizes the defects with MVTec HALCON. It becomes apparent how HALCON can be used to straightforwardly create a complete system for complex inspection tasks – without any special hardware.

MERLIC 4: User-friendly machine vision optimized by parallelization

MERLIC 4, the new release of the software for rapidly creating complete machine vision solutions, offers a wide range of functions that make machine vision even easier. The software has an outstanding new feature: parallelization, i.e., the ability to run separate tools at the same time.

A further live demo documents the practicality of this new function by performing different inspection tasks with the aid of two cameras, thereby demonstrating the parallelization feature. In addition, it shows how MVTec MERLIC precisely recognizes different fonts on packaging in just fractions of a second, using deep-learning-based OCR technologies. MVTec also illustrates the seamless integration of a programmable logic controller (PLC) into vision systems using MERLIC. Here, the advantageous integration of MERLIC via Hilscher cards is shown.

Besides, a touchscreen demo presents additional machine vision technologies on all aspects of MVTec HALCON and MERLIC, such as hyperspectral imaging and 3D vision.

As in past years, the MVTec booth will once again offer a forum, where experts will give presentations on new deep learning functionalities in HALCON 18.11 and the parallelization function in MERLIC4 every 30 minutes, alternating between German and English. In addition, MVTec will be part of the Industrial Vision Days with a presentation on HALCON 18.11 focusing on deep learning, and will participate in the School of VISION with a deep learning seminar as well. Moreover, MVTec will also be represented at the VISION standardization stand with a HALCON-based demo.

VISION 2018 also marks the 10th anniversary of MVTec’s “Image Acquisition Partner” program, which is the largest of its kind worldwide. MVTec will celebrate this and other partnerships during the course of an exclusive partner evening at the trade show.


PIXELINK

Will be showcasing their new cameras, the PL-D757 based on the IMX420 and the PL-D753 based on the IMX421.


Sony Europe

Sony to preview new category of machine vision module at Vision 2018

Sony Europe’s Image Sensing Solutions division is set to demonstrate the first in a new category of machine vision cameras at Vision 2018.

At the trade fair, it will unveil a new polarised-light module based on its 5 MP GS CMOS device.

Details of the camera will be made available to journalists and select customers at the show, with a public announcement made in Q4.

The polarised camera will be joined by an embedded vision concept camera and two new, as yet unannounced Sony modules: a 12 MP module based on the Camera Link transmission standard; and a 4K FCB block camera. Sony is set to announce technical specifications of these two modules in the lead-up to the Vision Show.

Sony’s Arnaud Destruels said: “At the show we’ll be highlighting several strategic additions to our strong and rapidly growing family of advanced GS CMOS machine vision cameras. In recent months, we expanded the line-up significantly, adding advanced pre-processing features and new capabilities such as IEEE1588-master-device functionality. In addition, we’ve added new transmission standards, launching our first USB 3 module.”


Teledyne DALSA to unveil breakthrough imaging

Teledyne DALSA will unveil a host of new products at the show, including three industry firsts – the first 5GigE area camera, a multi-line CMOS line scan camera, and a multi-array CMOS TDI camera that deliver unmatched performance.

Teledyne DALSA’s new Linea ML 8k and 16k cameras offer high speed and high-resolution mono, color, and multispectral imaging. These multi-line CMOS cameras will transform the way line scan cameras are used, offering options for monochrome/HDR, color, multispectral, and polarization imaging for a growing number of machine vision applications. Independent start and stop of integration for each array allows versatile illumination configurations in a single scan using pulsed LED lighting technologies.

The new Linea HS 16k camera is based on the latest charge domain CMOS TDI technology.

The multi-array TDI sensor enables high speed multi-field imaging where brightfield, darkfield, and backlit images can be captured in a single scan. Both Linea ML and HS run at a maximum line rate of 300kHz with a Camera Link HS interface using fiber optic cables.

The next gen Camera Link HS fiber interface is ideal for the most demanding applications that require high throughput, long cable length, and immunity to electromagnetic radiation in industrial environments.

The company is also expanding its Genie Nano camera series with eight new 5 Gigabit Ethernet models. A first in the market, the newest Genie™ Nano models offer reliable high-resolution, highspeed inspection for existing GigE machine vision systems and are built around the industry’s best performing CMOS image sensors from SONY. The monochrome and color 5-Gigabit models offer resolutions from 3.2Mpixels to 12Mpixels and Teledyne’s award-winning TurboDrive technology. These new Genie Nano models feature the brand new 5GBASE-T link speed.


UKIVA

UKIVA has a strong membership presence at the show, with 16 members exhibiting. The UKIVA booth will be available for any member to hold business meetings. This is particularly useful for those members who are attending, but not exhibiting and do not have their own stands.

Literature racks will be available on the booth where members can display their own publicity material alongside UKIVA”s own ‘Vision in Action’ publication. Vision in Action will also be available for collection from literature racks located at the entrance to the show. Information will also be available on the booth about the next Machine Vision Conference and Exhibition to be run in Spring 2019 by UKIVA.

The latest Autumn 2018 issue of Vision in Action contains a special 4-page feature on deep learning and machine learning as well as having a strong emphasis on real-life applications of vision. These include packaging applications for products as diverse as beer, cream, milk and ketchup, as well as a number of 3D robot applications including the automated picking of engine blocks.

UKIVA members who are exhibiting at the show are: Allied Vision, Baumer, Cognex, Framos, IDS Imaging Development Systems, ifm electronic, Imperx, Matrix Vision, Matrox Imaging, Omron, corpion Vision (Tordival), Sick, Sony, Stemmer Imaging, Tamron and wenglor sensoric.


XIMEA

Will be presenting their latest ground-breaking cameras in a newly designed exhibit booth. Super-fast PCIe interfaces, high resolution imagers, cooled scientific CMOS cameras and our newest subminiature USB3 camera with 18 MPixels will all be on display.

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